THERMOSETTING ADHESIVE FILM

摘要

PROBLEM TO BE SOLVED: To provide a film adhesive used for mounting of a semiconductor and capable of rapidly being cured. SOLUTION: The present invention provides a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound and curing agents for the polymer system. The polymer system comprises a base polymer and an electron donor and an electron acceptor functional group. The electron donor and the electron acceptor functional group can be pendant from the base polymer or can be interdispersed with the base polymer as independent compounds. COPYRIGHT: (C)2004,JPO