| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning device for electronic components suitable for cleaning of electronic components having cavity on a base material and reducing the cost by effectively removing a residue adhered in a gap between a circuit element and the base material. SOLUTION: The cleaning device for electronic components is formed by a flip-chip bonding through a bump 12 to a larger-sized base material 1 than the circuit element 10. The cleaning device is provided with an upper wall 27 adhered to the upper face of the circuit element 10, a side wall 22 adhered on a main face of the base material 1 protruded from the peripheral edge of the circuit element 10 close to two sides opposite to the peripheral edge of the circuit element 10, a supply passage 23 provided at one opening part except for the side wall 22 and supplying cleaning fluid toward the gap between the base material 1 and the circuit element 10, and a discharge passage 25 provided at the other opening part except for the side wall 22 and discharging the cleaning fluid made to flow through the gap. COPYRIGHT: (C)2004,JPO
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