| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition which is used for sealing semiconductors, does not stain when continuously molded, and has an excellent mold release property. SOLUTION: The epoxy resin composition for sealing the semiconductors is characterized by containing (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) molten spherical silica, and (E) a mold release agent as essential components, wherein the molten spherical silica is contained in an amount of 84 to 94 wt. % based on the total amount of the epoxy resin composition, has an average particle diameter of 25 to 40μm, and contains the molten spherical silica having particle diameters of≤1.0μm in an amount of 14 to 20 wt. % based on the total amount of the molten spherical silica. COPYRIGHT: (C)2004,JPO
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