Method of increasing mechanical properties of semiconductor substrates

摘要

Semiconductor wafers exhibiting increased mechanical strength and reduced susceptibility to fracture and methods of making the same are disclosed. The improved mechanical strength arises from a thin coating of a refractory material deposited on the backside of the wafer. Preferably, the coating is comprised of a ceramic. More preferably, the coating is comprised of silicon carbide. Also disclosed are methods for evaluating different coating materials.