发明名称 LASER PROCESSING APPARATUS AND MACHINING METHOD FOR WORKPIECE USING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser processing apparatus or the like which easily produces an optical wave guide plate with a narrow width and pitch or enables to execute other processings. <P>SOLUTION: The laser processing apparatus is provided with a laser oscillator, a condensing lens, and a tubular internal mirror. The tubular internal mirror is arranged to locate its inlet at a focal position of the condensing lens. A phase irradiated from the oscillator and multiply reflected by an internal surface of the internal mirror, beam tracing of laser beams with different power densities and the results obtained from the beam tracing are superposed by low of linear superposition. An inlet diameter, an outlet diameter, and a length of the internal mirror 1 are determined to converge a bright part of optical interference fringes generated at an outlet of the internal mirror on a central part of the outlet and to locate a dark part of the optical interference fringes at an outer periphery of the outlet. Periphery of the internal mirror 1 is covered with a cover 3 with its lower end opened, and the cover 3 is formed with suction hole 3B and the suction hole 3B is connected with a suction device 5. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004160463(A) 申请公布日期 2004.06.10
申请号 JP20020326389 申请日期 2002.11.11
申请人 HYOGO PREFECTURE 发明人 KISHIMOTO TADASHI
分类号 B23K26/14;B23K26/06;(IPC1-7):B23K26/14 主分类号 B23K26/14
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