发明名称 SPUTTERING TARGET AND POWDER FOR PRODUCING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a Sb-Te sputtering target which effectively prevents generation of particles, abnormal electric discharge, generation of nodules, occurrence of cracks or breakage, etc., in sputtering and of which the oxygen content is reduced; its production method; and a powder for sintering suitable for producing the sputtering target. <P>SOLUTION: The Sb-Te sputtering target has an average crystal particle size of 20μm or lower, a bending strength of 60 MPa or higher, and an oxygen content of 1,000 ppm or lower. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004162109(A) 申请公布日期 2004.06.10
申请号 JP20020328368 申请日期 2002.11.12
申请人 NIKKO MATERIALS CO LTD 发明人 TAKAHASHI HIDEYUKI;YAHAGI MASATAKA;NAKAMURA ATSUSHI
分类号 B22F1/00;C22C1/04;C22C12/00;C23C14/34;(IPC1-7):C23C14/34 主分类号 B22F1/00
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