发明名称 Cooling device for an integrated circuit
摘要 A cooling device is secured to an integrated circuit, such as a CPU, for being thermally coupled to the integrated circuit to dissipate heat therefrom. The cooling device is attached to a housing of a computer in which the integrated circuit sits. This attaching is performed by a set of fasteners, such as bolts. These fasteners may be heat conductive to aide in the dissipation of heat from the integrated circuit.
申请公布号 US2004109301(A1) 申请公布日期 2004.06.10
申请号 US20030636480 申请日期 2003.08.07
申请人 SHIH-TSUNG CHEN 发明人 SHIH-TSUNG CHEN
分类号 H01L23/40;H01L23/427;(IPC1-7):F28F7/00;H02B1/01 主分类号 H01L23/40
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