发明名称 Method and apparatus for making very low roughness copper foil
摘要 A method for manufacturing a very low roughness copper foil and an apparatus for manufacturing the copper foil. In the method of the present invention, a pickling process, an electrolytic polishing process and a washing process are successively performed after the copper foil was manufactured. In order to manufacture the very low roughness copper foil, the electrolytic polishing process is accomplished with the copper foil to face a metal cathode plate and supplying a current in order to perform the electrolytic polishing.
申请公布号 US2004108216(A1) 申请公布日期 2004.06.10
申请号 US20030722469 申请日期 2003.11.28
申请人 LG CABLE LTD. 发明人 JO CHA JAE;CHOI CHANG HEE;KIM SANGYUM;KIM JEONG IK
分类号 C25F3/16;C25F3/02;H05K3/07;H05K3/38;(IPC1-7):B23H3/00 主分类号 C25F3/16
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