发明名称 STRAINED FINFET CMOS DEVICE STRUCTURES
摘要 <p>A semiconductor device structure, includes a PMOS device (200) and an NMOS device (300) disposed on a substrate (1, 2) the PMOS device including a compressive layer (6) stressing an active region of the PMOS device, the NMOS device including a tensile layer (9) stressing an active region of the NMOS device, wherein the compressive layer includes a first dielectric material, the tensile layer includes a second dielectric material, and the PMOS and NMOS devices are FinFET devices (200, 300).</p>
申请公布号 WO2004049406(A1) 申请公布日期 2004.06.10
申请号 WO2002US37931 申请日期 2002.11.25
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION;DORIS, BRUCE, B.;CHIDAMBARRAO, DURESETI;IEONG, MEIKEI;MANDELMAN, JACK, A. 发明人 DORIS, BRUCE, B.;CHIDAMBARRAO, DURESETI;IEONG, MEIKEI;MANDELMAN, JACK, A.
分类号 H01L27/12;H01L21/00;H01L21/336;H01L21/8238;H01L27/092;H01L29/786;(IPC1-7):H01L21/00 主分类号 H01L27/12
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