LASER MODULE AND ITS FABRICATION METHOD

摘要

A laser module comprises a sub-mount (10), a semiconductor laser (3) secured to the surface of the sub-mount (10), and an optical waveguide device (2) joined to the surface of the sub-mount through an adhesive layer (11) and optically coupled to the semiconductor laser. A first groove (12) parallel to the emission edge of the semiconductor laser with a predetermined spacing is made in the surface of the sub-mount. The first groove is so disposed in the area of the sub-mount as to correspond to the input side of the optical waveguide device. The end of the adhesive layer, on the input side of the optical waveguide device can lie in the range from the farther rim of the first groove from the semiconductor laser to the inside of the first groove. The end of the adhesive layer is out of contact with the emission edge of the semiconductor laser. Since the adhesive layer can be thus disposed in a preferable range, miscoupling due to distortion caused by a thermal change is suppressed.