发明名称 |
LASER BEAM MACHINING METHOD AND DROPLET DISCHARGE HEAD |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To enable a target shape to be machined without using a die or a photomask in the method for machining a first material of a laminated member in which the first material projects from a second material. <P>SOLUTION: This is a machining method for a laminated member 10 in which a metallic thin film 12 is laminated on the bottom face of a silicon substrate 11 in a manner projecting from the end 11A of the silicon substrate 11. The metallic thin film 12 is cut by irradiating a boundary between the end 11A of the silicon substrate 11 and the metallic thin film 12 with a laser beam having such a wavelength that an optical absorptance is higher for the metallic thin film 12 than for the silicon substrate 11. <P>COPYRIGHT: (C)2004,JPO</p> |
申请公布号 |
JP2004160524(A) |
申请公布日期 |
2004.06.10 |
申请号 |
JP20020331712 |
申请日期 |
2002.11.15 |
申请人 |
SEIKO EPSON CORP |
发明人 |
SAWAKI DAISUKE;SHIMADA KATSUTO;UMETSU KAZUNARI |
分类号 |
B41J2/045;B23K26/00;B23K26/03;B23K26/06;B23K26/40;B41J2/055;B41J2/16;B81C99/00;(IPC1-7):B23K26/00;B81C5/00 |
主分类号 |
B41J2/045 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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