发明名称 LASER BEAM MACHINING METHOD AND DROPLET DISCHARGE HEAD
摘要 <p><P>PROBLEM TO BE SOLVED: To enable a target shape to be machined without using a die or a photomask in the method for machining a first material of a laminated member in which the first material projects from a second material. <P>SOLUTION: This is a machining method for a laminated member 10 in which a metallic thin film 12 is laminated on the bottom face of a silicon substrate 11 in a manner projecting from the end 11A of the silicon substrate 11. The metallic thin film 12 is cut by irradiating a boundary between the end 11A of the silicon substrate 11 and the metallic thin film 12 with a laser beam having such a wavelength that an optical absorptance is higher for the metallic thin film 12 than for the silicon substrate 11. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004160524(A) 申请公布日期 2004.06.10
申请号 JP20020331712 申请日期 2002.11.15
申请人 SEIKO EPSON CORP 发明人 SAWAKI DAISUKE;SHIMADA KATSUTO;UMETSU KAZUNARI
分类号 B41J2/045;B23K26/00;B23K26/03;B23K26/06;B23K26/40;B41J2/055;B41J2/16;B81C99/00;(IPC1-7):B23K26/00;B81C5/00 主分类号 B41J2/045
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