| 发明名称 |
METHOD FOR LASER BEAM MACHINING |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for laser beam machining, which improves a throughput of laser beam machining. <P>SOLUTION: A work 26 to be machined is irradiated with a laser beam through a stencil mask 24 equipped with through-holes of a prescribed pattern. A thin-film material on the work 26 to be machined is directly machined and patterned by the laser beam passing through the through-holes of the prescribed pattern. <P>COPYRIGHT: (C)2004,JPO</p> |
| 申请公布号 |
JP2004160518(A) |
申请公布日期 |
2004.06.10 |
| 申请号 |
JP20020331231 |
申请日期 |
2002.11.14 |
| 申请人 |
SONY CORP |
发明人 |
KIYOI KIYOMI;SASAKI YOSHINARI;ASO YUKINARI;MURASE EIJU;YOSHIDA KAZUHIKO |
| 分类号 |
G02F1/1368;B23K26/06;(IPC1-7):B23K26/06;G02F1/136 |
主分类号 |
G02F1/1368 |
| 代理机构 |
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