| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a lead frame for pre-mold package in which adhesiveness between a lead frame and resin can be secured and resin can easily be removed even if resin adheres to a part except for a part which is resin-sealed, and to provide a manufacturing method of the lead frame, a pre-mold package and a manufacturing method of the package. <P>SOLUTION: A conductive material is set to be a base material, and a lead frame 10 patterned in a desired shape is used. For using the package, surfaces of a die pad 11 and an inner lead part 13 in the lead frame 10 exposed into the package 18 are mirror finished, and the other surface region of the lead frame 10 that is resin-sealed is rough end. The lead frame 10 formed in such a way is used for the pre-mold package, and resin burrs can easily be peeled. <P>COPYRIGHT: (C)2004,JPO</p> |
