INTEGRATED PLATING AND PLANARIZATION APPARATUS HAVING COUNTER ELECTRODE WITH VARIABLE DIAMETER

摘要

PROBLEM TO BE SOLVED: To provide an integrated plating and planarization apparatus having a counter electrode with a variable diameter. SOLUTION: The apparatus for plating and planarizing a metal on a substrate is provided with a plurality of distribution segments each of which has at least one hole for distributing an electroplating solution onto the substrate. The distribution segments form a circular counter electrode and is movable with respect to each other during an electroplating process so that the counter electrode may have a variable diameter. Thus, the electroplating solution is distributed onto the annular part of the substrate having a diameter corresponding to the diameter of the counter electrode. Therefore, the counter electrode can allow the local delivery of the plating solution onto the substrate. COPYRIGHT: (C)2004,JPO