| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal coating film formation method capable of forming a film having high conductivity and high adhesiveness by low-temperature baking. SOLUTION: This metal coating film formation method includes a process for applying a dispersion body prepared by dispersing a reducible metal oxide having a particle diameter below 200 nm in an organic dispersing medium to a substrate, thereafter baking it in a non-oxidizing atmosphere, and then baking it in a reducing atmosphere. The obtained metal film is suitably used for application to a metal wiring material, a conductive material and the like. COPYRIGHT: (C)2004,JPO
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