| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting device wherein a light emitting element formed with electrodes on one and the same surface can be stably mounted by flip chip bonding technology with respect to lead electrodes located in a concave portion of a package. <P>SOLUTION: The light emitting device comprises the package 7 which has the concvave portion and is formed by insert molding so that the pair of positive and negative lead electrodes 4 may be exposed on the bottom of the concave portion, and the light emitting element 1 mounted face down on the lead electrodes 4. Between the lead electrodes and the light emitting element 1, there is a sub-mount 2 whereon the light emitting element can be mounted. The sub-mount 2 is provided with a conductive member at least on the front surface, and the conductive member is electrically connected to the light emitting element 1 and the lead electrodes 4 via a conductive joint member 3. <P>COPYRIGHT: (C)2004,JPO |
