摘要 |
PROBLEM TO BE SOLVED: To suppress unstable operation of an electronic circuit due to wiring resistance on a substrate. SOLUTION: IC chips 51 and 53 are mounted on a second substrate 12. The chips 51 and 53 have a mounting face 5A where a terminal connected to wiring 125 for external connection on the second substrate 12 is disposed, and a conductive face 5B conductive to a part of an electronic circuit 504. While, an IC chip 31 mounted on a flexible wiring board 20 has a conductive face 3B conductive to a part of an electronic circuit 304. A sub-wiring board 41 is provided with wiring 404 connecting the conductive face 5B of the IC chips 51 and 53 to the conductive face 3B of the IC chip 31. COPYRIGHT: (C)2004,JPO
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