| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board on which the electrode of an electronic component can be connected firmly to a soldering pad. SOLUTION: After an electroless-plated copper layer 3a is formed on the surface of an insulating substrate 1 in a coating state, a plating resist layer 11 having an opening 11a exposing the soldering pad 3 forming portion of the copper layer 3a is formed on the copper layer 3a, and an electroplated copper layer 3b, an electroplated nickel layer 5, and an electroless-plated gold layer 6 are successively formed on the portion of the copper layer 3a exposed in the opening 11a. Then, after the resist layer 11 is peeled off, the soldering pad 3 is formed by etching off the electroless-plated copper layer 3a except the soldering pad forming portion, and the portion of the electroless-plate gold layer 6 formed on the outer peripheral section of the pad 3 is etched off. After etching off, a solder-resistant resin layer 4 is formed. COPYRIGHT: (C)2004,JPO
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