| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that a reinforcing layer is to be arranged and a thick insulator layer is to be formed against crush of second wiring (air wiring) in conventional air bridge wiring and that impedance measurement for long measurement time and appearance check with much man-hours are required as a screening method of crush. SOLUTION: A wiring structure is provided with first wiring 2 formed along a semiconductor substrate 1, a protection insulating film 3 (thickness is 500Å, for example) covering an almost surface of a semiconductor region including the first wiring 2 for maintaining moisture resistance and second wiring 5 (air wiring) crossing the first wiring 2 through a space 4. The protection insulating film 3 does not exist on the surface of the first wiring 2 just below second wiring 5 (air wiring). COPYRIGHT: (C)2004,JPO
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