| 摘要 |
A semiconductor integrated circuit including a digital circuit and an analog circuit which are integrated on a single semiconductor chip comprises a first electrostatic destruction protection circuit, connected to a digital circuit, for protecting the digital circuit from destruction caused by ESD therein by an influence of an input digital signal and a second electrostatic destruction protection circuit, connected to an analog circuit, for protecting the analog circuit from destruction caused by ESD therein by an influence of an input analog signal. A first grounding conductor connected to the first electrostatic destruction protection circuit and a second grounding conductor connected to the second electrostatic destruction protection circuit are connected to each other outside the semiconductor integrated circuit.
|
