发明名称 |
SCHLEIFMITTELZUSAMMENSETZUNG ZUM POLIEREN EINES HALBLEITERBAUTEILS UND HERSTELLUNG DES HALBLEITERBAUTEILS MIT DERSELBEN |
摘要 |
An abrasive composition for polishing a semiconductor device, comprising cerium oxide, a water-soluble organic compound having at least one group of -COOH, -COOMX (wherein MX is an atom or a functional group capable of substituting a H atom to form a salt), -SO3H or -SO3MY (wherein MY is an atom or a functional group capable of substituting a H atom to form a salt), and water a process for forming shallow trench isolations using this abrasive composition. |
申请公布号 |
DE69917010(D1) |
申请公布日期 |
2004.06.09 |
申请号 |
DE1999617010 |
申请日期 |
1999.02.24 |
申请人 |
SHOWA DENKO K.K., TOKIO/TOKYO |
发明人 |
KIDO, TAKANORI;ICHIKAWA, KAGETAKA |
分类号 |
C09K3/14;H01L21/3105 |
主分类号 |
C09K3/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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