ADHESIVE COMPOSITION TO FORM ADHESIVE FILM, AND SEMICONDUCTOR APPARATUS USING THE SAME

摘要

PURPOSE: Provided is an adhesive composition for forming an adhesive film having excellent storage stability in attachment of electrode parts and semiconductor chips without variation of coating amount. CONSTITUTION: The composition comprises micro capsules having core/shell structure(D) and containing epoxy resin(A), phenol resin(B), synthetic resin(C) and a curing accelerator. The core part containing the curing accelerator is enclosed by the shell part made of thermoplastic resin material. The shell part is formed of polyurea comprising an isocyanate compound containing triisocyanate compound(1) of the formula(1) and triisocyanate compound(2) of the formula(2) in a combination mole ratio of 100/0 to 30/70. The shell part of the microcapsule(D) is formed of polyurea comprising a triisocyanate compound(3) of the formula(3) wherein R is a secondary organic group.