Process and device for removal of surface layer

摘要

The surface of the substrate (1.6) is scanned with a laser beam (1.1) concentrated onto a focus (1.5). A thin layer (1.4a) of a fluid (1.4) is applied to a surface element before it is subjected to radiation. The surface element is irradiated by laser for a short time, in particular, shorter than 10 ms. An explosion like evaporation and removal of the surface layer are achieved. The focussing and scanning system (1.2) is combined with a unit for delivery of the fluid (1. 4), and a unit (1.3) for sucking away the evaporated fluid and the material of the surface layer.