发明名称 |
Curable silicone composition and electronic components |
摘要 |
<p>A curable silicon composition, comprising (A) 100 parts by weight of an organopolysiloxane containing silicon-bonded aryl groups and at least two alkenyl groups per molecule, and having a viscosity of from 0.01 to 1,000 Pa.s at 25 DEG C, wherein the aryl groups comprise from 1 to 40 mole% of the total silicon-bonded organic groups in the organopolysiloxane; (B) an organopolysiloxane having a viscosity of from 0.001 to 10 Pa.s at 25 DEG C and containing at least 2 silicon-bonded hydrogen atoms per molecule, in a quantity sufficient to cure the composition; (C) a platinum catalyst in a quantity sufficient to cure the composition; and (D) 0.00001 to 100 parts by weight of an organopolysiloxane having a viscosity of from 0.01 to 10,000 Pa.s at 25 DEG C, with the proviso that when the organopolysiloxane contains aryl groups, the aryl groups comprise less than 1 mole% or more than 40 mole% of the total silicon-bonded organic groups in the organopolysiloxane, and wherein the orgiopolysiloxane cures to form a silicone having a complex modulus ≤ 1 x 10<8> Pa at -65 DEG C and a shear frequency of 10 Hz or a cured silicone having a Young's modulus ≤ 2.9 x 10<8> Pa at -65 DEG C.</p> |
申请公布号 |
EP0908499(B1) |
申请公布日期 |
2004.06.09 |
申请号 |
EP19980119254 |
申请日期 |
1998.10.13 |
申请人 |
DOW CORNING TORAY SILICONE COMPANY, LTD. |
发明人 |
ISSHIKI, MINORU;MINE, KATSUTOSHI;OTANI, YOSHIKO;YAMAKAWA, KIMIO |
分类号 |
C08L83/04;C08L83/07;C09J183/04;H01L21/56;H01L21/58;H01L23/29;H01L23/31;(IPC1-7):C09J183/04 |
主分类号 |
C08L83/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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