| 摘要 |
<p>A high frequency module substrate device used in a high frequency module apparatus, which is adapted for switching pass-frequency characteristic of band-pass filter by switching and is adapted so that optimum band-pass filter characteristic is obtained in all pass-frequency bands, wherein a thin film capacitor element (18) is constituted between a base substrate (2) in which the uppermost layer is flattened with organic substrate being as core substrates (5), (6) to constitute a buildup formation surface (16) and a high frequency circuit unit (3) of lumped parameter design formed on the buildup formation surface in a laminated manner to carry out switching of load of parallel capacity with respect to a coupler (11) having frequency characteristic of lambda /4 which has been caused to undergo distributed parameter design at the base substrate portion side of the thin film capacitor through switch means (4). <IMAGE></p> |
