发明名称 INTEGRATED CIRCUIT DEVICE AND FABRICATION USING METAL-DOPED CHALCOGENIDE MATERIALS
摘要 A method of forming a chalcogenide memory element having a first electrode, a second electrode, and a doped chalcogenide layer interposed between the first electrode and the second electrode, the method comprising: forming a chalcogenide layer (215) on the first electrode (210); sputtering metal (240) onto the chalcogenide layer using a first plasma containing at least one component gas selected from the group consisting of neon and helium, thereby forming the doped chalcogenide layer (230), wherein the first plasma emits a UV component sufficient to induce diffusion of the sputtered metal into the chalcogenide layer; and sputtering metal (245) onto the doped chalcogenide layer using a second plasma containing at least one component gas having an atomic weight higher than an atomic weight of neon, thereby forming the second electrode (250).
申请公布号 EP1425431(A2) 申请公布日期 2004.06.09
申请号 EP20020766168 申请日期 2002.08.30
申请人 MICRON TECHNOLOGY, INC. 发明人 LI, JIUTAO;MCTEER, ALLEN
分类号 C23C14/34;C23C14/06;C23C14/54;C23C14/58;H01L27/105;H01L27/24;H01L45/00;(IPC1-7):C23C14/18 主分类号 C23C14/34
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