Chip feeder and method for feeding semiconductor chips

摘要

A chip-feed device has a retaining device (110) for holding a wafer (100) in the region of a removal position (E), in which the wafer is arranged on the retaining device with its active side (120) facing downwards. A takeoff/removal device (280) removes the semiconductor chips (108) from the wafer at the removal position (E), and a transport device (200) transports the chips (100) from the takeoff position (E) into a transfer position (U).