| 摘要 |
A vacuum treatment device, comprising a vacuum treatment chamber (1) etching a semiconductor wafer (W) as a body to be treated and a preliminary vacuum chamber (2) communicating with the vacuum treatment chamber (1), wherein a transfer arm (5) and first and second buffers (6, 7) for temporarily supporting the wafer (W) are installed in the preliminary vacuum chamber (2), the transfer arm (5) is provided with a flexible arm part (5a) and a support part (16) supporting the wafer (W), the arm part (5a) is extended and retracted by the rotations of a drive side swing arm (14) and a driven side swing arm (15) forming the arm (5a) so as to move the support part (16) straight forward and backward while maintaining it in its attitude, and the first and second buffers (6, 7) are disposed on the motion route of the support part (16) of the transfer arm (5).
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