发明名称 Spring-loaded heat sink assembly for a circuit assembly
摘要 A spring-loaded heat sink assembly for a circuit assembly, an installation tool, and a method of installation. The assembly comprises a heat sink, a load plate, and at least one leaf spring positioned therebetween. The load plate comprises elongate shafts having an open channel therethrough which extend through the leaf spring(s) and heat sink and at least partially through the circuit assembly. The elongate shafts provide a space for the leaf spring(s) between the heat sink and load plate. Fasteners extend through the elongate shafts to connect the spring-loaded heat sink assembly to the circuit assembly.
申请公布号 US6746270(B2) 申请公布日期 2004.06.08
申请号 US20030602221 申请日期 2003.06.23
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 PETERSON ERIC C.;CROMWELL S. DANIEL
分类号 H01R33/76;H01L23/32;H01R12/04;H01R12/16;H05K1/18;H05K3/32;H05K3/36;(IPC1-7):H01R3/00 主分类号 H01R33/76
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