| 发明名称 |
Semiconductor wafer with a dicing line overlapping a defect |
| 摘要 |
A dicing lines is placed to overlap a slip created in a wafer, so that the slip extends within the dicing line.
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| 申请公布号 |
US6747337(B1) |
申请公布日期 |
2004.06.08 |
| 申请号 |
US20000713339 |
申请日期 |
2000.11.16 |
| 申请人 |
RENESAS TECHNOLOGY CORP. |
发明人 |
YAMAMOTO HIDEKAZU;KIMURA YASUHIRO |
| 分类号 |
H01L21/301;H01L21/02;H01L21/78;H01L23/544;(IPC1-7):H01L23/544 |
主分类号 |
H01L21/301 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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