发明名称 |
Method and packaging structure for optimizing warpage of flip chip organic packages |
摘要 |
An electronic packaging structure and method of forming thereof wherein the structure is constituted of a modular arrangement which reduces stresses generated in a chip, underfill, and ball grid array connection with a flexible substrate in the form of an organic material, which stresses may result in potential delamination due to thermally-induced warpage between the components of the modular arrangement.
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申请公布号 |
US6747331(B2) |
申请公布日期 |
2004.06.08 |
申请号 |
US20020197335 |
申请日期 |
2002.07.17 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
INFANTOLINO WILLIAM;LI LI;ROSSER STEVEN G.;SATHE SANJEEV BALWANT |
分类号 |
H01L21/60;H01L21/56;H01L23/10;H01L23/498;(IPC1-7):H01L31/00 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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