| 摘要 |
PURPOSE: To obtain a wire bonder in which insufficient contact between adjacent balls is eliminates even if the inner electrodes are arranged at a fine pitch in a semiconductor device by forming a right spherical ball at the tip of a wire coaxially therewith. CONSTITUTION: Discharge takes place between the tip 1 of a bonding wire 2 and an electrode 4. The wire is fused, at the tip thereof, through discharge and a ball is formed by the surface tension. The electrode 4 is coated with an insulator except the part facing the tip 1 of the wire. |
