发明名称 SURFACE TREATMENT APPARATUS USING ATMOSPHERIC PRESSURE PLASMA
摘要 PURPOSE: A plasma apparatus is provided which not only improves a narrow available treatment width that is a problem generated in a conventional flat plate type electrode structure, but also solves reduction of plasma discharge space that is a problem generated by cylindrical electrode. CONSTITUTION: The surface treatment apparatus using atmospheric pressure plasma comprises a treatment gas storage part(300) and a plasma generation part(400) positioned under the treatment gas storage part, wherein the treatment gas storage part comprises first inflow ports(301a,301b) for introducing treatment gas into the treatment gas storage part, and the plasma generation part comprises upper electrode(401a) and lower electrode(401b) oppositely directed to each other, a plasma generating space(402) formed between the two electrodes, insulators for insulating the upper electrode and the lower electrode, radiators(404a,404b) for lowering surface temperature of the electrodes, second inflow ports(405a,405b) for introducing the treatment gas into the plasma generating space from the treatment gas storage part, exhaust ports(406a-406e) for exhausting plasma produced in the plasma generating space and the treatment gas that is not converted into plasma, and an AC power source(407) for impressing an AC voltage, wherein both of the upper electrode and the lower electrode are flat plate type electrodes, the exhaust ports are formed on the lower electrode, a substrate(408) is positioned under the lower electrode, and surface of the substrate is treated by generating plasma under the atmospheric pressure.
申请公布号 KR20040048272(A) 申请公布日期 2004.06.07
申请号 KR20020076071 申请日期 2002.12.02
申请人 SEMTECHNOLOGY CO., LTD. 发明人 LEE, HAK JU
分类号 C23C16/50;H01J37/32;(IPC1-7):C23C16/50 主分类号 C23C16/50
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