BRIDGE TYPE PROBE CARD AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A bridge type probe card and a manufacturing method thereof are provided to be capable of forming a probe tip at a silicon layer for improving the mechanical and electrical characteristics of the probe tip. CONSTITUTION: A bridge type probe card is provided with the first silicon layer(111) having a spring part(117) and more than one tip part(119) connected with the center portion of the spring part as one piece, an insulating layer(112) formed at both sides of the first silicon layer, the second silicon layer(113) formed on the insulating layer, and a conductive layer(129) formed at a through hole(123). At this time, the through hole is vertically formed through the first and second silicon layer, and the partial portion of the insulating layer. The bridge type probe card further includes a PCB(Printed Circuit Board)(200) electrically connected with the second conductive layer of the second silicon layer and a metal line formed at the spring part and the tip part for being electrically connected with the first conductive part of the first silicon layer.