ELECTRONIC COMPONENT MOUNTING STRUCTURE IN WHICH VIA HOLE IS FORMED ON CONTACT PAD OF ELECTRONIC COMPONENT, AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: An electronic component mounting structure and a manufacturing method thereof are provided to prevent damages on circuit elements located beneath the vicinity of a contact pad by forming a via hole by etching dielectric layer on the contact pad of a semiconductor chip by using a laser. CONSTITUTION: An electronic component mounting structure includes a mounting body, an electronic element(20) placed on the mounting body, an interlayer dielectric layer(28a), a via hole(28y) and an interconnection pattern(26b). The electronic element includes a contact pads(18) formed with an accumulated layer structure having an etching stopper layer on an uppermost layer. The contact pad of the electronic element is implemented upward. The interlayer dielectric layer covers the electronic element. The via hole is formed at least in a predetermined portion of the dielectric layer on the contact pad of the electronic element. The interconnection pattern is connected to the contact pad through the via hole. The etching stopper layer is one of copper, gold, silver, and conductive paste layers.