发明名称 RESIN MOLDING DEVICE WITH SUBSTRATE THICKNESS VARIATION ABSORBING CAPABILITY
摘要 <p>PURPOSE: A resin molding device is provided to prevent works from being damaged by absorbing a variation of substrate thickness. CONSTITUTION: A resin molding machine includes a press part, a cavity plate(11), a setting part, an input/output part, and an aligning part. The resin molding machine is used to mold a work(2) with resin. The press part includes a molding die(6) which is used for clamping and molding the work. The cavity plate includes a cavity hole(13) defining a shape and thickness of a resin molding part of the work. The setting part places the work in the press part. The input/output part repeatedly carries the cavity plate into and out from the press part. The aligning part positions the cavity plate onto the molding die. The cavity plate is a metal belt which is circulated or reciprocally moved on a clamping face of the molding die.</p>
申请公布号 KR20040047691(A) 申请公布日期 2004.06.05
申请号 KR20030084911 申请日期 2003.11.27
申请人 APIC YAMADA CORPORATION 发明人 TOFUKUJII SHIGEYUKI;SAKAMOTO TOMOO
分类号 H01L21/56;B29C43/36;B29C45/02;(IPC1-7):H01L21/56 主分类号 H01L21/56
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