THERMALLY CONDUCTIVE EPOXY RESIN MOLDINGS OBTAINED FROM EPOXY RESIN COMPOSITION WITH SPECIFIC ORIENTATION DEGREE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: Provided is a thermally conductive epoxy resin molding which has excellent thermal conductivity conformed to the latest electronic components showing a tendency to increase heat emission. CONSTITUTION: The thermally conductive epoxy resin molding is obtained by curing an epoxy resin composition containing epoxy resin. The orientation degree(alpha) of the epoxy resin is 0.5 or more and less than 1.0, and is determined by the formula of: alpha= (180-delta(beta))/180, wherein delta(beta) is the half width of a peak in an intensity distribution as determined by varying the orientation angle from 0 to 360 deg., after fixing the peak scattering angle obtained by the X-ray diffraction.