METHOD FOR PICKING SEMICONDUCTOR CHIPS FROM FOIL USING CHIP GRIPPER

摘要

PURPOSE: A method for picking semiconductor chips from a foil is provided to improve picking up operation of semiconductor chips by preventing a chip gripper from impacting the chip with too much power. CONSTITUTION: A semiconductor chip is picked up by a chip gripper is movably supported in z-axis on a bond head(1). A needle dispatches the semiconductor chip from a foil. A chip gripper(2) is lowered to a position higher than an average height of the semiconductor chip so that the chip gripper does not touch the semiconductor chip. The needle raises the semiconductor chip in order to make the semiconductor chip touch the chip gripper and then to raise the position of the chip gripper by lowering the needle to a predetermined position. The semiconductor chip is dispatched from the needle by raising the chip gripper.