发明名称 SINTERING METHOD FOR SUPPRESSING EXUDING OF COPPER FROM W-Cu COMPOSITE MATERIAL
摘要 PURPOSE: A method for densifying the W-Cu composite material as suppressing exuding of copper from the W-Cu composite material when performing densification process of W-Cu composite material by liquid phase sintering is provided. CONSTITUTION: The sintering method for suppressing exuding of copper from W-Cu composite material comprises a step of maintaining a W-Cu composite material prepared by press forming W-Cu composite powder in the copper solidification temperature range of 800 to 1,083 (except 1,083 deg.C) at a reducing gas atmosphere for 0.5 to 10 hours; and a step of cooling the temperature increased W-Cu composite material right after increasing temperature of the W-Cu composite material to 1,200 to 1,400 deg.C, wherein the W-Cu composite powder is prepared by reduction heat treating the milled mixed powder in a hydrogen atmosphere after mixing tungsten (WO3 and WO2.9) powder with copper oxide (CuO and Cu2O) powder and milling the mixed powder, and the W-Cu composite powder is a globular powder having a certain size formed in such a shape that W powder surrounds Cu powder. The sintering method for suppressing exuding of copper from W-Cu composite material comprises a step of maintaining a W-Cu composite material prepared by press forming W-Cu composite powder in the temperature range of 1,083 to 1,150 that is right above a copper melting point at a reducing gas atmosphere for 0.5 to 10 hours; and a step of cooling the temperature increased W-Cu composite material right after increasing temperature of the W-Cu composite material to 1,200 to 1,400 deg.C.
申请公布号 KR20040047451(A) 申请公布日期 2004.06.05
申请号 KR20020075678 申请日期 2002.11.30
申请人 AGENCY FOR DEFENSE DEVELOPMENT 发明人 HONG, MUN HUI;KIM, DAE GEON;KIM, EUN PYO;KIM, YEONG DO;LEE, SEONG;LEE, SEONG HO;NOH, JUN UNG
分类号 B22F3/10;B22F1/00;B22F9/22;C22C1/04;C22C27/04;H01H1/025;(IPC1-7):B22F3/10 主分类号 B22F3/10
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