| 摘要 |
PURPOSE: A heat sink structure is provided to prevent damages of electronic components and achieve improved radiating effect by enhancing the heat sink structure. CONSTITUTION: A heat sink(2) comprises an electronic component mounting surface(220) where an electronic component surface contacts; and component supporting protrusions(210a,210b) for supporting the side surface of an electronic component(1). The heat sink has the corner where the electronic component mounting surface and the component supporting protrusions meet, wherein the corner of the heat sink has a groove(200) for permitting the heat radiated from the corner of the electronic component to escape through the groove.
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