ENCAPSULATION THIN FILM MATERIAL COMPRISING POLYMERIZED PRODUCTS OF TETRAOXASPIRO-MONOMER OR DIOXANE MONOMER, AND ENCAPSULATION METHOD USING THE SAME

摘要

PURPOSE: Provided is an encapsulation thin film material, which protects moisture and oxygen responsible for the deterioration of an electric device comprising an organic compound, thereby increasing the life of the device. CONSTITUTION: The encapsulation thin film material used for encapsulation of an electric device comprising an organic compound layer comprises polymerized products of divinyl tetraoxaspiro-monomer or dioxane monomer represented by at least one formula selected from the group consisting of the formulas, wherein each of R1 and R2 is -R-CH=CH2; at least two selected from R3-R6 are -R-CH=CH2 and the others are -H or -R; at least two selected from R7-R9 are -R-CH=CH2 and the others are -H or -R; and R is a non-substituted C1-C8 alkyl or a C1-C8 alkyl substituted with an alkoxy, acyl, alkoxycarbonyl, acyloxycarbonyl, acylamino or silyl, a non-substituted C6-C12 aryl, or a C6-C12 aryl substituted with an alkoxy, acyl, alkoxycarbonyl, acyloxycarbonyl, acylamino or silyl.