发明名称 SEMICONDUCTOR DEVICE PREVENTING BREAKDOWN OF INSULATING LAYER BETWEEN ELECTRODES
摘要 PURPOSE: A semiconductor device is provided to prevent breakdown of an insulating layer between electrodes by reducing a voltage between the electrodes. CONSTITUTION: A semiconductor device includes a semiconductor substrate(500), an insulating layer(101,102,103) formed on the semiconductor substrate, a first electrode(201) extended on the insulating layer and receiving a first electric potential applied thereto, a second electrode(202) formed to be isolated from surroundings, a third electrode(203) capacitively coupled with the second electrode, and a cross section. A second electric potential lower than the first electric potential is applied to the third electrode. The cross section is perpendicular to a direction of extension of the first electrode and the second electrode can be located on a side opposite to the first electrode on the cross section.
申请公布号 KR20040047526(A) 申请公布日期 2004.06.05
申请号 KR20030031971 申请日期 2003.05.20
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 SHIMIZU KAZUHIRO
分类号 H01L23/52;H01L21/3205;H01L21/822;H01L21/8234;H01L21/8238;H01L23/522;H01L23/528;H01L23/552;H01L23/58;H01L23/60;H01L27/04;H01L27/06;H01L27/088;H01L27/092;H01L29/06;H01L29/40;H01L29/423;H01L29/78;(IPC1-7):H01L23/60 主分类号 H01L23/52
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