发明名称 LIQUID COMPOSITION FOR ETCHING METALLIC THIN FILM COMPRISING SILVER AS PRINCIPAL COMPONENT
摘要 PURPOSE: Provided is a liquid composition for etching a metallic thin film pattern comprising silver a principal component with high precision, forming an excellent pattern shape and having excellent practicability at the same time. CONSTITUTION: In a liquid composition for etching a metallic thin film comprising silver a principal component, the liquid composition is obtained by blending 40 to 50 wt.% of phosphoric acid, 1.5 to 3.5 wt.% of nitric acid, 25 to 40 wt.% of acetic acid, and water, wherein the metallic thin film is silver (Ag), silver (Ag)-palladium (Pd) alloy, or silver (Ag)-palladium (Pd)-copper (Cu) alloy.
申请公布号 KR20040047634(A) 申请公布日期 2004.06.05
申请号 KR20030084114 申请日期 2003.11.25
申请人 KANTO KAGAKU KABUSIKI KAISHA 发明人 OSHIRO KENJI;SHIMIZU TOSHIKAZU;KAGEYAMA KENJI
分类号 G02F1/1335;C09K13/06;C23F1/30;G02F1/1343;(IPC1-7):C23F1/30 主分类号 G02F1/1335
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