METHOD FOR FABRICATING LEADFRAME

摘要

PURPOSE: A method for fabricating a leadframe is provided to prevent a process defect from being generated in the first silver delamination process by adding an anti-substitution plating process after a pre-treatment process and by omitting the first silver delamination process. CONSTITUTION: After a pre-treatment process for cleaning the surface of a leadframe material of copper or a copper alloy, the surface of the leadframe material is plated with silver and unnecessary silver is delaminated. An anti-substitution plating process for supplying a silver substitution preventing solution to the leadframe material is performed to prevent copper and silver from being substituted so that a multi-step silver delamination process is reduced.