| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for cleaning a microscopic structure which can efficiently remove a contaminant such as a resist residue, etc. without a damaging a substance necessary for a semiconductor wafer such as a low-k film, etc., particularly. SOLUTION: The method for cleaning the microscopic structure includes the steps of forming a cleaning agent composition indispensably containing carbon dioxide and a cleaning component in a fluid state at a high pressure, bringing the composition into contact with the microscopic structure, and removing the substance adhering to the structure. In this method, hydrogen fluoride is used as the cleaning component. COPYRIGHT: (C)2004,JPO
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