ADHESIVE TAPE FOR SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive tape for a semiconductor device which has superior wire-bonding properties. SOLUTION: The adhesive tape for a semiconductor device is such that a thermosetting adhesive layer is formed at least on one face of an insulation film. The product of the reciprocal of the thickness of the thermosetting adhesive layer and an elastic modulus loss of the thermosetting adhesive layer at 200°C is 0.25 MPa/μm or larger. COPYRIGHT: (C)2004,JPO