发明名称 SOLUBLE POLYIMIDE FOR PHOTOSENSITIVE POLYIMIDE PRECURSOR AND PHOTOSENSITIVE POLYIMIDE PRECURSOR CONTAINING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a soluble polyimide for a photosensitive polyimide precursor and the photosensitive polyimide precursor composition containing the same. <P>SOLUTION: This soluble polyimide for a photosensitive polyimide precursor is expressed by general formula 1 [X is a tetravalent aromatic or aliphatic organic group; Y is a divalent aromatic or aliphatic organic group; R<SP>1</SP>, R<SP>2</SP>are each independently a monovalent organic group expressed by CH or CH<SB>2</SB>OR<SB>3</SB>(R<SP>3</SP>is &le;6 alkyl) excluding a case of both R<SP>1</SP>, R<SP>2</SP>are H; and (m) is 10-1,000 integer], and contains reactive blocking groups at its one end or both of the ends. The photosensitive polyimide precursor composition contains the soluble polyamide, a polyamic acid containing the reactive blocking groups at its one end or both of the ends, a photo acid generator (PAG) and selectively, a dissolution suppressor. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004156012(A) 申请公布日期 2004.06.03
申请号 JP20030166405 申请日期 2003.06.11
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 JUNG MYUNG SUP;PARK YONG YOUNG;JUNG SUNG KYUNG;YANG SANG YOON
分类号 G03F7/004;C08F299/02;C08G73/10;G03F7/027;G03F7/038;G03F7/039;G03F7/075;H01L21/027 主分类号 G03F7/004
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