PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM RESIST USING THE SAME AND FLEXIBLE PRINTED WIRING BOARD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition and a photosensitive dry film resist which not only realize high flame retardancy required for an electronic material but have excellent physical properties such as heat resistance and moisture resistance and contains no halogen, and to provide a flexible printed wiring board (FPC) using the above material.

SOLUTION: An organic phosphorous composition prepared by mixing a phosphine oxide compound having a hydroxy group and an epoxy compound having a reactive double bond, or a compound obtained by allowing the above compounds to react is used as a flame retardant. Thereby, excellent flame retardant property can be obtained while preventing influences on various kinds of physical properties of the photosensitive resin composition and the photosensitive dry film resist. In particular, the obtained material is suitable to be used for manufacturing an FPC.

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