EPOXY RESIN COMPOSITION, ELECTRONIC PART APPARATUS USING THE SAME AND METHOD FOR PRODUCING THE APPARATUS

摘要

PROBLEM TO BE SOLVED: To obtain an epoxy resin composition which has reduced defects in electrical properties such as deformation of gold wire, breaking of wire and leakage failure in sealed molding of a fine-pitch wiring semiconductor element and to provide an electronic part apparatus sealed with the epoxy resin composition. SOLUTION: The epoxy resin composition comprises (A) an epoxy resin, (B) a curing agent, (C) a curing promoter and (D) an inorganic filler as main components. (D) The inorganic filler contains≥50 mass % of a spherical or milled inorganic filler in the whole inorganic filler. The apparent minimum melt viscosity of the epoxy resin composition by a slit type viscosity measuring device is 28.0 Pa×s at 50 s-1shear rate and≤9.0 Pa×s at 300 s-1shear rate. The pressure in a cavity in molding is atmospheric pressure or above. COPYRIGHT: (C)2004,JPO