| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing resin composition which is excellent in reliability both in crack resistance at a high temperature for reflowing particularly at the time of mounting on the surface and in moisture resistance, contains substantially no brominated flame retardant, and has low permittivity and low dielectric dissipation factor. SOLUTION: The sealing resin composition contains no brominated flame retardant and comprises essentially (A) a specified biphenyl aralkyl epoxy resin, (B) a curing agent comprising an ester resin represented by the formula (wherein X is an alkyl group or an aryl group), (C) a cure accelerator, (D) silica, and (E) a coupling agent. This semiconductor sealing device is a device sealed by using the resin composition. COPYRIGHT: (C)2004,JPO
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